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Source: International journal of thermal sciences. 2023. Vol. 192, Part A. P. 108402 (1-20)
Type: статьи в журналах
Date: 2023
Description:
Flow and heat transfer dynamics are extremely complicated phenomena in various enclosures. The mechanism of heat transmission and its enhancement due to the presence of nanoscale particles is an impor
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Source: Journal of thermal analysis and calorimetry. 2021. Vol. 146, № 2. P. 725-738
Type: статьи в журналах
Date: 2021
Description:
The cooling process of electronic devices having heat-generating elements is a major challenge allowing to develop electronics industry. Therefore, a creation of novel cooling techniques is an importa
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Source: International journal of mechanical sciences. 2020. Vol. 165. P. 105192 (1-12)
Type: статьи в журналах
Date: 2020
Description:
Intensification of energy transport in different engineering devices is the challenge for many scientists and engi- neers. This problem can be solved by usage of various fins within the device and eff
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Source: Journal of thermal analysis and calorimetry. 2019. Vol. 136, № 2. P. 673-686
Type: статьи в журналах
Date: 2019
Description:
Development of various electronic devices demands to create effective cooling complexes. The present paper deals with computational analysis of mixed convection cooling of heat-conducting and heat-gen
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