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Authors:
Veale, Matthew C. |
Booker, P. |
Church, I. |
Jones, L. L. |
Lipp, J. |
Schneider, Andreas |
Seller, Paul H. |
Wilson, Matthew D. |
Chsherbakov, Ivan |
Kolesnikova, Irina I. |
Lozinskaya, Anastassiya D. |
Novikov, Vladimir A. |
Tolbanov, Oleg P. |
Tyazhev, Anton V. |
Zarubin, Andrei N.
Source: Nuclear instruments and methods in physics research Section A: accelerators, spectrometers, detectors and associated equipment. 2022. Vol. 1025. P. 166083 (1-9)
Type: статьи в журналах
Date: 2022
Description:
In this paper a new version of the HEXITEC spectroscopic imaging technology is presented. The HEXITEC ASIC maintains the same pixel electronics but, unlike the previous design, contains no I/O pads on
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Authors:
Chiriotti, Sabina |
Barten, Rebecca |
Bergamaschi, Anna |
Carulla, M. |
Chsherbakov, Ivan |
Dinapoli, Roberto |
Fröjdh, Erik |
Greiffenberg, Dominic |
Hasanaj, Shqipe |
Hinger, V. |
King, T. |
Kozlowski, Pawel |
López-Cuenca, Carlos |
Lozinskaya, Anastassiya D. |
Marone, F. |
Mezza, Davide |
Moustakas, K. |
Mozzanica, Aldo |
Ruder, Christian |
Schmitt, Bernd |
Thattil, Dhanya |
Tolbanov, Oleg P. |
Tyazhev, Anton V. |
Zarubin, Andrei N. |
Zhang, J. |
Brückner, Martin
Source: Journal of instrumentation : electronic journal. 2022. Vol. 17, № 4. P. P04007 (1-17)
Type: статьи в журналах
Date: 2022
Description:
The aim of this project is to determine the imaging capabilities of a 25 μ m pixel pitch GaAs:Cr sensor of 500 μm thickness bump-bonded to the charge integrating MÖNCH 03 readout chip (also called GaA
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