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Source: Journal of thermal analysis and calorimetry. 2019. Vol. 136, № 2. P. 673-686
Type: статьи в журналах
Date: 2019
Description:
Development of various electronic devices demands to create effective cooling complexes. The present paper deals with computational analysis of mixed convection cooling of heat-conducting and heat-gen
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Source: Journal of thermal analysis and calorimetry. 2019. Vol. 135, № 2. P. 1095-1105
Type: статьи в журналах
Date: 2019
Description:
Convective flow and heat transfer in an alumina/water nanofluid enclosure having two centered adherent porous blocks under the effect of moving upper wall have been analyzed numerically. The control p
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Source: International journal of heat and mass transfer. 2019. Vol. 130. P. 564-574
Type: статьи в журналах
Date: 2019
Description:
Cooling of electronic devices is a very important topic. The present paper deals with numerical simulation of natural convection cooling of heat-conducting and heat-generating source using an alumina-
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