Characterisation of the HEXITEC4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology
- Title
- Characterisation of the HEXITECX4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology
- Version
- 1.x
- Pages
- 9
- Size
- 5 MB
- Producer
- pdfTeX
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